完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Peng, An-Sam | en_US |
dc.contributor.author | Cho, Ming-Hsiang | en_US |
dc.contributor.author | Wang, Yueh-Hua | en_US |
dc.contributor.author | Wang, Meng-Fang | en_US |
dc.contributor.author | Chen, David | en_US |
dc.contributor.author | Wu, Lin-Kun | en_US |
dc.date.accessioned | 2014-12-08T15:33:44Z | - |
dc.date.available | 2014-12-08T15:33:44Z | - |
dc.date.issued | 2013-10-01 | en_US |
dc.identifier.issn | 0916-8524 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1587/transele.E96.C.1289 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/23316 | - |
dc.description.abstract | In this paper, a novel and simple one-port de-embedding technique has been applied to through-silicon-via (TSV) characterization and modeling. This method utilized pad, via, and line structures to extract the equivalent circuit model of TSV. The main advantage of this de-embedding method is that it can reduce the chip area to fabricate test element groups (TEGs) for measurements while keeping S-parameter measurement accuracies. We also analyzed the electrical characteristics of substrate coupling and TSV equivalent impedance. Our results shows good agreements between measurement data and the equivalent circuit model up to 20 GHz. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | 3D IC | en_US |
dc.subject | TSV | en_US |
dc.subject | de-embedding | en_US |
dc.subject | TEGs | en_US |
dc.subject | microwave | en_US |
dc.subject | RF modeling | en_US |
dc.title | Through-Silicon-Via Characterization and Modeling Using a Novel One-Port De-Embedding Technique | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1587/transele.E96.C.1289 | en_US |
dc.identifier.journal | IEICE TRANSACTIONS ON ELECTRONICS | en_US |
dc.citation.volume | E96C | en_US |
dc.citation.issue | 10 | en_US |
dc.citation.spage | 1289 | en_US |
dc.citation.epage | 1293 | en_US |
dc.contributor.department | 電機工程學系 | zh_TW |
dc.contributor.department | Department of Electrical and Computer Engineering | en_US |
dc.identifier.wosnumber | WOS:000326667800011 | - |
dc.citation.woscount | 0 | - |
顯示於類別: | 期刊論文 |