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dc.contributor.authorChang, Geng-Weien_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorJhu, Jhe-Ciouen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorSyu, Yong-Enen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorJian, Fu-Yenen_US
dc.contributor.authorHung, Ya-Chien_US
dc.contributor.authorTai, Ya-Hsiangen_US
dc.date.accessioned2014-12-08T15:33:45Z-
dc.date.available2014-12-08T15:33:45Z-
dc.date.issued2013-09-01en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.surfcoat.2012.04.086en_US
dc.identifier.urihttp://hdl.handle.net/11536/23327-
dc.description.abstractN2O plasma treatment suppressed the temperature-dependent sub-threshold leakage current of amorphous indium-gallium-zinc-oxide thin film transistors (a-IGZO TFTs). For untreated devices, the transfer curve exhibited abnormal electrical properties at high temperature. The abnormal electrical properties are explained by the energy band diagrams for both forward and reverse sweep. Above 400 K, holes can be generated from trap-assisted transition, and drift to the source side which induces source barrier lowering. The source side barrier lowering enhances electron injection from the source to channel and causes an apparent sub-threshold leakage current. This phenomenon, which is experimentally verified, only appears in the device without N2O plasma treatment, but not in the device with N2O plasma treatment. The results suggested that the density of states for a-IGZO with N2O plasma treatment is much lower than that without plasma treatment. (C) 2012 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectIndium gallium zinc oxide (IGZO)en_US
dc.subjectThin film transistors (TFTs)en_US
dc.subjectN2O plasma treatmenten_US
dc.titleN2O plasma treatment suppressed temperature-dependent sub-threshold leakage current of amorphous indium-gallium-zinc-oxide thin film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.surfcoat.2012.04.086en_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume231en_US
dc.citation.issueen_US
dc.citation.spage281en_US
dc.citation.epage284en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000328094200061-
dc.citation.woscount0-
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