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dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:33:55Z-
dc.date.available2014-12-08T15:33:55Z-
dc.date.issued2014-01-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2013.2290117en_US
dc.identifier.urihttp://hdl.handle.net/11536/23386-
dc.description.abstractThe power consumption of capacitor leakage current, increase of the capacitor aspect ratio, and lack of higher dielectric constant (kappa) material are the difficult challenges to downscaling dynamic random access memory (DRAM). This letter reports a new one-transistor ferroelectric-MOSFET (1T FeMOS) device that displays DRAM functions of a 5 ns switching time, 10(12) on/off endurance cycles, and 30 times on/off retention windows at 5 s and 85 degrees C. A simple 1T process and a considerably low OFF-state leakage of 3 x 10(-12) A/mu m were achieved. This novel device was achieved by applying ferroelectric ZrHfO gate dielectric to a p-MOSFET, which is fully compatible with existing high-kappa CMOS processing.en_US
dc.language.isoen_USen_US
dc.subjectFerroelectricen_US
dc.subjectZrHfOen_US
dc.subject1Ten_US
dc.subjectDRAMen_US
dc.subjectFeMOSen_US
dc.subjectMOSFETen_US
dc.subjectmemoryen_US
dc.titleLow-Leakage-Current DRAM-Like Memory Using a One-Transistor Ferroelectric MOSFET With a Hf-Based Gate Dielectricen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2013.2290117en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume35en_US
dc.citation.issue1en_US
dc.citation.spage138en_US
dc.citation.epage140en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000329061300046-
dc.citation.woscount4-
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