标题: | Analytic Solution to Product Acceptance Determination for Gold Bumping Process With Multiple Manufacturing Lines |
作者: | Pearn, Wen Lea Tai, Yu Ting Wu, Chia Huang Chuang, Ching Ching 工业工程与管理学系 Department of Industrial Engineering and Management |
关键字: | Gold bumping;manufacturing quality;process capability;product acceptance determination |
公开日期: | 1-十一月-2013 |
摘要: | In recent years, gold bumping process has been applied extensively for the package technology of liquid crystal display driver integrated circuit, which is an essential component in portable devices. Because the increasing requirement of high-definition display devices, the gold bumping process has become more difficult and it is requested to be of high quality with very low fraction of defectives. Unfortunately, conventional methods for product acceptance determination no longer work because any sample of reasonable size probably contains no defective gold bump product items. In addition, in the globally competitive manufacturing environment, gold bumping processes involving multiple manufacturing lines are quite common in the Science-Based Industrial Park in Hsinchu, Taiwan, because of economic scale considerations. In this paper, we provide analytical solutions to gold bump product acceptance determination, which provide both manufacturers and customers to reserve their own rights by compromising on a rule for gold bumping process with multiple manufacturing lines. For the convenience of inplant applications, we tabulate the number of required inspection units, the critical acceptance values for various manufacturer's risks and consumer's risks, and various number of manufacturing lines. For illustration purpose, a real application in a gold bumping factory, which is located in the Science-Based Industrial Park in Hsinchu, Taiwan, is included. |
URI: | http://dx.doi.org/10.1109/TCPMT.2013.2279889 http://hdl.handle.net/11536/23464 |
ISSN: | 2156-3950 |
DOI: | 10.1109/TCPMT.2013.2279889 |
期刊: | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY |
Volume: | 3 |
Issue: | 11 |
起始页: | 1980 |
结束页: | 1986 |
显示于类别: | Articles |
文件中的档案:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.