Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces

標題:	Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
作者:	Liu, Chien-Min Lin, Han-Wen Chu, Yi-Cheng Chen, Chih Lyu, Dian-Rong Chen, Kuan-Neng Tu, K. N. 材料科學與工程學系電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics
關鍵字:	Cu-to-Cu direct bonding;Creep;Diffusion;Preferred orientation
公開日期:	1-May-2014
摘要:	We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 degrees C at a stress of 114 psi for 30 min at 10(-3) torr. The temperature is lower than the reflow temperature of 250 degrees C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI:	http://dx.doi.org/10.1016/j.scriptamat.2014.01.040 http://hdl.handle.net/11536/24211
ISSN:	1359-6462
DOI:	10.1016/j.scriptamat.2014.01.040
期刊:	SCRIPTA MATERIALIA
Volume:	78-79
Issue:
起始頁:	65
結束頁:	68
Appears in Collections:	Articles

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