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dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorYang, Shao-Yuen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorChen, Yin-Nienen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:35:52Z-
dc.date.available2014-12-08T15:35:52Z-
dc.date.issued2014-04-01en_US
dc.identifier.issn0026-2714en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.microrel.2013.12.026en_US
dc.identifier.urihttp://hdl.handle.net/11536/24251-
dc.description.abstractIn this paper, we comprehensively review the impacts of single-trap-induced random telegraph noise (RTN) on FinFET, Ge/Si Nanowire FET and Tunnel FET (TFET). The resulting influences on the thermionic-based current conduction such as FinFET, Si-NW FET and Ge-NW FET (at low drain bias) as well as interband tunneling dominated current conduction such as TFET and high-drain-biased Ge-NW FET are extensively addressed in device and circuit level. The location of the trap is shown to have profound impacts and the impacts vary with bias conditions and trap types. The worst-case analysis of the stability/performance and leakage/delay for all possible trapping/detrapping RTN combinations are investigated for FinFET, Si-/Ge-NW FETs and TFET based 6T/8T SRAM cells and logic circuits. (C) 2014 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleSingle-trap-induced random telegraph noise for FinFET, Si/Ge Nanowire FET, Tunnel FET, SRAM and logic circuitsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.microrel.2013.12.026en_US
dc.identifier.journalMICROELECTRONICS RELIABILITYen_US
dc.citation.volume54en_US
dc.citation.issue4en_US
dc.citation.spage698en_US
dc.citation.epage711en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000335283100003-
dc.citation.woscount1-
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