Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization

doi:10.1063/1.4874608

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DC Field	Value	Language
dc.contributor.author	Chiu, Wei-Lan	en_US
dc.contributor.author	Liu, Chien-Min	en_US
dc.contributor.author	Haung, Yi-Sa	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2014-12-08T15:36:08Z	-
dc.date.available	2014-12-08T15:36:08Z	-
dc.date.issued	2014-04-28	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://dx.doi.org/10.1063/1.4874608	en_US
dc.identifier.uri	http://hdl.handle.net/11536/24471	-
dc.description.abstract	Cu3Sn intermetallic compounds (IMCs) are more resistant to fracture than solders. In addition, the Cu3Sn IMCs are more conductive than the solders. In this study, we manufactured Cu3Sn IMCs to serve as a joint using electroplated nanotwinned Cu as a metallization layer to react with pure Sn at 260 degrees C and 340 degrees C. The results show that there were almost no Kirkendall voids generated inside the Cu3Sn layer. In addition, the kinetics of the Cu3Sn growth was analyzed to predict the time needed to form the Cu3Sn joint. (C) 2014 AIP Publishing LLC.	en_US
dc.language.iso	en_US	en_US
dc.title	Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1063/1.4874608	en_US
dc.identifier.journal	APPLIED PHYSICS LETTERS	en_US
dc.citation.volume	104	en_US
dc.citation.issue	17	en_US
dc.citation.epage		en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000336142500027	-
dc.citation.woscount	1	-
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