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dc.contributor.authorChin, Alberten_US
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorChiu, Y. C.en_US
dc.contributor.authorZheng, Z. W.en_US
dc.contributor.authorLiu, M.en_US
dc.date.accessioned2014-12-08T15:36:13Z-
dc.date.available2014-12-08T15:36:13Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-60768-352-0en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/24562-
dc.identifier.urihttp://dx.doi.org/10.1149/05004.0003ecsten_US
dc.description.abstractVery low 0.4 pJ switching energy, fast 50 ns switching time, large > 10(5) retention window at 85 degrees C, and 10(6) cycling endurance were achieved in Ni/GeOx/SrTiOy/TaN RRAM. This RRAM device has negative temperature coefficient (TC) and ruled by bulk hopping conduction mechanism that lead to potentially better distribution. This is in sharp contrast to the positive TC and randomly distributed metallic filament RRAM. Such low switching energy is necessary for large-array NAND memory application, a unique merit of this RRAM device.en_US
dc.language.isoen_USen_US
dc.titleUltra-Low Switching Power RRAM Using Hopping Conduction Mechanismen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/05004.0003ecsten_US
dc.identifier.journalDIELECTRIC MATERIALS AND METALS FOR NANOELECTRONICS AND PHOTONICS 10en_US
dc.citation.volume50en_US
dc.citation.issue4en_US
dc.citation.spage3en_US
dc.citation.epage8en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000337757800001-
Appears in Collections:Conferences Paper