Grain growth in electroplated (111)-oriented nanotwinned Cu

標題:	Grain growth in electroplated (111)-oriented nanotwinned Cu
作者:	Huang, Yi-Sa Liu, Chien-Min Chiu, Wei-Lan Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering
關鍵字:	Grain growth;Nanotwinned Cu;Preferred orientation;Electroplated Cu
公開日期:	15-十月-2014
摘要:	The grain growth of pulse-plated (111)-oriented nanotwinned Cu (nt-Cu) was investigated at 200-350 degrees C. The results indicate that after the annealing, the nt-Cu exhibits good thermal stability, and columnar grains with a (111)-oriented nt-Cu structure are maintained up to 300 degrees C. The columnar grains consume the original fine-grained region at the bottom of the sample. In addition, these fine grains were converted into nanotwinned columnar grains with a (111) orientation. The electroplated Cu film possessed extremely high (111) preferred orientation after the annealing. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI:	http://dx.doi.org/10.1016/j.scriptamat.2014.06.008 http://hdl.handle.net/11536/25021
ISSN:	1359-6462
DOI:	10.1016/j.scriptamat.2014.06.008
期刊:	SCRIPTA MATERIALIA
Volume:	89
Issue:
起始頁:	5
結束頁:	8
顯示於類別：	期刊論文

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