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dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorChen, Yin-Nienen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:36:58Z-
dc.date.available2014-12-08T15:36:58Z-
dc.date.issued2014-10-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2014.2348856en_US
dc.identifier.urihttp://hdl.handle.net/11536/25363-
dc.description.abstractThis paper extensively evaluates the stability and performance of heterochannel 6T/8T SRAM cells integrated in monolithic 3-D scheme with interlayer coupling. Various bitcell layouts with different gate alignments of transistors from distinct layers are investigated. This paper indicates that stacking the NFET tier over the PFET tier results in larger design margins for cell robustness and performance. Furthermore, the partition of 3-D layout design among distinct layers shows profound impacts on the stability, standby leakage, and performance of monolithic 3-D SRAM cells. Compared with the Si-based cells, the use of heterochannel devices increases the improvements of monolithic 3-D design over the 2-D counterparts and emerges as a suitable candidate for future monolithic 3-D IC applications.en_US
dc.language.isoen_USen_US
dc.titleStability and Performance Optimization of Heterochannel Monolithic 3-D SRAM Cells Considering Interlayer Couplingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2014.2348856en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume61en_US
dc.citation.issue10en_US
dc.citation.spage3448en_US
dc.citation.epage3455en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000342909800014-
dc.citation.woscount0-
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