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dc.contributor.authorLee, TLen_US
dc.contributor.authorLee, MZen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:37:01Z-
dc.date.available2014-12-08T15:37:01Z-
dc.date.issued2005en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/25435-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1851052en_US
dc.description.abstractThis paper investigates the effects of Zr capping on nickel silicided n(+)/p shallow junctions. Although nickel silicide possesses many benefits compared with titanium and cobalt silicide, some potential problems still need to be addressed for ultrashallow junction applications. In this work, a Zr protective cap is used to preserve the silicide from oxygen contamination and to suppress the increase of junction leakage during the silicidation process. Due to the suppressed leakage current and the appropriate series resistence, formation of a 30 nm ultrashallow junction can be accomplished. (C) 2005 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleImprovement of junction leakage by using a Zr cap layer on a 30 nm ultrashallow nickel-silicide junctionen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1851052en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume152en_US
dc.citation.issue2en_US
dc.citation.spageG158en_US
dc.citation.epageG162en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000227142400069-
dc.citation.woscount4-
Appears in Collections:Articles


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