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dc.contributor.authorWang, SDen_US
dc.contributor.authorLo, WHen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:37:03Z-
dc.date.available2014-12-08T15:37:03Z-
dc.date.issued2005en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/25442-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1955166en_US
dc.description.abstractA CF4 plasma treatment on solid-phase-crystallized (SPC) poly-Si thin-film transistors ( TFTs ) has been demonstrated. Using this technique, fluorine atoms can be introduced into the poly-Si film to passivate the defects, and hence, the device performance of the SPC poly-Si TFTs can be significantly improved. The fluorinated SPC poly- Si TFTs exhibit a good subthreshold slope, low threshold voltage, and high field effect mobility. Moreover, the fluorinated SPC poly- Si TFTs also exhibit an improved hot-carrier-stress immunity, which is due to the strong Si-F bonds formed in the poly-Si channel region. (c) 2005 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleCF4 plasma treatment for fabricating high-performance and reliable solid-phase-crystallized poly-Si TFTsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1955166en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume152en_US
dc.citation.issue9en_US
dc.citation.spageG703en_US
dc.citation.epageG706en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231066300070-
dc.citation.woscount21-
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