完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Wang, SD | en_US |
dc.contributor.author | Lo, WH | en_US |
dc.contributor.author | Lei, TF | en_US |
dc.date.accessioned | 2014-12-08T15:37:03Z | - |
dc.date.available | 2014-12-08T15:37:03Z | - |
dc.date.issued | 2005 | en_US |
dc.identifier.issn | 0013-4651 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/25442 | - |
dc.identifier.uri | http://dx.doi.org/10.1149/1.1955166 | en_US |
dc.description.abstract | A CF4 plasma treatment on solid-phase-crystallized (SPC) poly-Si thin-film transistors ( TFTs ) has been demonstrated. Using this technique, fluorine atoms can be introduced into the poly-Si film to passivate the defects, and hence, the device performance of the SPC poly-Si TFTs can be significantly improved. The fluorinated SPC poly- Si TFTs exhibit a good subthreshold slope, low threshold voltage, and high field effect mobility. Moreover, the fluorinated SPC poly- Si TFTs also exhibit an improved hot-carrier-stress immunity, which is due to the strong Si-F bonds formed in the poly-Si channel region. (c) 2005 The Electrochemical Society. | en_US |
dc.language.iso | en_US | en_US |
dc.title | CF4 plasma treatment for fabricating high-performance and reliable solid-phase-crystallized poly-Si TFTs | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1149/1.1955166 | en_US |
dc.identifier.journal | JOURNAL OF THE ELECTROCHEMICAL SOCIETY | en_US |
dc.citation.volume | 152 | en_US |
dc.citation.issue | 9 | en_US |
dc.citation.spage | G703 | en_US |
dc.citation.epage | G706 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000231066300070 | - |
dc.citation.woscount | 21 | - |
顯示於類別: | 期刊論文 |