標題: A compact model for electrostatic discharge protection nanoelectronics simulation
作者: Chou, Hung-Mu
Yu, Shao-Ming
Lee, Jam-Wem
Li, Yiming
電信工程研究所
友訊交大聯合研發中心
Institute of Communications Engineering
D Link NCTU Joint Res Ctr
關鍵字: geometry effect;ESD modelling;SPICE simulation;whole chip design;nanoelectronics
公開日期: 2005
摘要: In nanoelectronics, snapback phenomena play an important role in electrostatic discharge (ESD) protection devices, in particular for gigascale, very large scale integration (VLSI) circuit design. In this paper we present a new ESD equivalent circuit model for deep submicrion and nanoscale semiconductor device simulation. By considering the geometry effect in the formulation of snapback characteristics, our model can be directly incorporated into electronic circuit simulation for the whole chip ESD protection circuit design. With the developed ESD model, we can investigate robust enhancement problems and perform a SPICE based whole chip ESD protection circuit design in nanoelectronics.
URI: http://hdl.handle.net/11536/25525
http://dx.doi.org/10.1504/IJNT.2005.008061
ISSN: 1475-7435
DOI: 10.1504/IJNT.2005.008061
期刊: INTERNATIONAL JOURNAL OF NANOTECHNOLOGY
Volume: 2
Issue: 3
起始頁: 226
結束頁: 238
顯示於類別:期刊論文