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dc.contributor.authorChou, Hung-Muen_US
dc.contributor.authorYu, Shao-Mingen_US
dc.contributor.authorLee, Jam-Wemen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2014-12-08T15:37:09Z-
dc.date.available2014-12-08T15:37:09Z-
dc.date.issued2005en_US
dc.identifier.issn1475-7435en_US
dc.identifier.urihttp://hdl.handle.net/11536/25525-
dc.identifier.urihttp://dx.doi.org/10.1504/IJNT.2005.008061en_US
dc.description.abstractIn nanoelectronics, snapback phenomena play an important role in electrostatic discharge (ESD) protection devices, in particular for gigascale, very large scale integration (VLSI) circuit design. In this paper we present a new ESD equivalent circuit model for deep submicrion and nanoscale semiconductor device simulation. By considering the geometry effect in the formulation of snapback characteristics, our model can be directly incorporated into electronic circuit simulation for the whole chip ESD protection circuit design. With the developed ESD model, we can investigate robust enhancement problems and perform a SPICE based whole chip ESD protection circuit design in nanoelectronics.en_US
dc.language.isoen_USen_US
dc.subjectgeometry effecten_US
dc.subjectESD modellingen_US
dc.subjectSPICE simulationen_US
dc.subjectwhole chip designen_US
dc.subjectnanoelectronicsen_US
dc.titleA compact model for electrostatic discharge protection nanoelectronics simulationen_US
dc.typeArticleen_US
dc.identifier.doi10.1504/IJNT.2005.008061en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF NANOTECHNOLOGYen_US
dc.citation.volume2en_US
dc.citation.issue3en_US
dc.citation.spage226en_US
dc.citation.epage238en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.department友訊交大聯合研發中心zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.contributor.departmentD Link NCTU Joint Res Ctren_US
dc.identifier.wosnumberWOS:000239797700004-
dc.citation.woscount0-
Appears in Collections:Articles