標題: | A compact model for electrostatic discharge protection nanoelectronics simulation |
作者: | Chou, Hung-Mu Yu, Shao-Ming Lee, Jam-Wem Li, Yiming 電信工程研究所 友訊交大聯合研發中心 Institute of Communications Engineering D Link NCTU Joint Res Ctr |
關鍵字: | geometry effect;ESD modelling;SPICE simulation;whole chip design;nanoelectronics |
公開日期: | 2005 |
摘要: | In nanoelectronics, snapback phenomena play an important role in electrostatic discharge (ESD) protection devices, in particular for gigascale, very large scale integration (VLSI) circuit design. In this paper we present a new ESD equivalent circuit model for deep submicrion and nanoscale semiconductor device simulation. By considering the geometry effect in the formulation of snapback characteristics, our model can be directly incorporated into electronic circuit simulation for the whole chip ESD protection circuit design. With the developed ESD model, we can investigate robust enhancement problems and perform a SPICE based whole chip ESD protection circuit design in nanoelectronics. |
URI: | http://hdl.handle.net/11536/25525 http://dx.doi.org/10.1504/IJNT.2005.008061 |
ISSN: | 1475-7435 |
DOI: | 10.1504/IJNT.2005.008061 |
期刊: | INTERNATIONAL JOURNAL OF NANOTECHNOLOGY |
Volume: | 2 |
Issue: | 3 |
起始頁: | 226 |
結束頁: | 238 |
Appears in Collections: | Articles |