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dc.contributor.authorChang, TCen_US
dc.contributor.authorYan, STen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorLin, ZWen_US
dc.contributor.authorAoki, Hen_US
dc.contributor.authorSze, SMen_US
dc.date.accessioned2014-12-08T15:37:17Z-
dc.date.available2014-12-08T15:37:17Z-
dc.date.issued2004-11-22en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2004.05.002en_US
dc.identifier.urihttp://hdl.handle.net/11536/25630-
dc.language.isoen_USen_US
dc.titleExtraction of electrical mechanisms of low-dielectric constant material MSZ for interconnect applications (Vol 447, pg 516, 2004)en_US
dc.typeCorrectionen_US
dc.identifier.doi10.1016/j.tsf.2004.05.002en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume467en_US
dc.citation.issue1-2en_US
dc.citation.spage342en_US
dc.citation.epage342en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000224185100055-
dc.citation.woscount0-
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