完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen, W. B.en_US
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:38:25Z-
dc.date.available2014-12-08T15:38:25Z-
dc.date.issued2010-12-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2010.2079270en_US
dc.identifier.urihttp://hdl.handle.net/11536/26302-
dc.description.abstractThis brief presents high-performance Ge n-MOSFETs with good high-field mobility of 218 cm(2)/V . s at 0.5 MV/cm, low subthreshold swing (SS) of 108 mV/dec, small equivalent oxide thickness (EOT) of 1.6 nm, low 7 x 10(-10) A/mu m OFF-state leakage, small bias temperature instability of 31 mV at 1.2 V overdrive and 85 degrees C, and full process compatibility with current very large-scale integration fabrication. These are one of the best SS and high-field mobility data among gate-first Ge n-MOSFETs using epitaxial Ge on 6-in Si wafer and proper high-kappa LaAlO(3) dielectric without using an interfacial layer. Using a different high-kappa HfAlO gate dielectric, the Ge n-MOSFETs showed poor leakage, large flatband voltage shift, and degraded EOT.en_US
dc.language.isoen_USen_US
dc.titleHigh-Performance Gate-First Epitaxial Ge n-MOSFETs on Si With LaAlO(3) Gate Dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2010.2079270en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume57en_US
dc.citation.issue12en_US
dc.citation.spage3525en_US
dc.citation.epage3530en_US
dc.contributor.department光電學院zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentCollege of Photonicsen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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