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dc.contributor.authorYeh, Kuo-Liangen_US
dc.contributor.authorKu, Chih-Youen_US
dc.contributor.authorGuo, Jyh-Chyurnen_US
dc.date.accessioned2014-12-08T15:39:09Z-
dc.date.available2014-12-08T15:39:09Z-
dc.date.issued2010en_US
dc.identifier.isbn978-1-4244-6241-4en_US
dc.identifier.issn1529-2517en_US
dc.identifier.urihttp://hdl.handle.net/11536/26754-
dc.identifier.urihttp://dx.doi.org/10.1109/RFIC.2010.5477296en_US
dc.description.abstractLayout dependent stress in 90 nm MOSFET and its impact on high frequency performance and flicker noise has been investigated. Donut MOSFETs were created to eliminate the transverse stress from shallow trench isolation (STI). Both NMOS and PMOS can benefit from the donut layout in terms of higher effective mobility mu(eff) and cutoff frequency f(T), as well as lower flicker noise. The measured flicker noise follows number fluctuation model for NMOS and mobility fluctuation model for PMOS, respectively. The reduction of flicker noise suggests the reduction of STI generated traps and the suppression of mobility fluctuation due to eliminated transverse stress using donut structure.en_US
dc.language.isoen_USen_US
dc.subjectDonuten_US
dc.subjectShallow-Trench Isolation (STI)en_US
dc.subjectStressen_US
dc.subjectMobilityen_US
dc.subjectFlicker noiseen_US
dc.titleThe Impact of MOSFET Layout Dependent Stress on High Frequency Characteristics and Flicker Noiseen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/RFIC.2010.5477296en_US
dc.identifier.journal2010 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS RFIC SYMPOSIUMen_US
dc.citation.spage577en_US
dc.citation.epage580en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000287515700132-
Appears in Collections:Conferences Paper


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