Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yeh, Kuo-Liang | en_US |
dc.contributor.author | Ku, Chih-You | en_US |
dc.contributor.author | Guo, Jyh-Chyurn | en_US |
dc.date.accessioned | 2014-12-08T15:39:09Z | - |
dc.date.available | 2014-12-08T15:39:09Z | - |
dc.date.issued | 2010 | en_US |
dc.identifier.isbn | 978-1-4244-6241-4 | en_US |
dc.identifier.issn | 1529-2517 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/26754 | - |
dc.identifier.uri | http://dx.doi.org/10.1109/RFIC.2010.5477296 | en_US |
dc.description.abstract | Layout dependent stress in 90 nm MOSFET and its impact on high frequency performance and flicker noise has been investigated. Donut MOSFETs were created to eliminate the transverse stress from shallow trench isolation (STI). Both NMOS and PMOS can benefit from the donut layout in terms of higher effective mobility mu(eff) and cutoff frequency f(T), as well as lower flicker noise. The measured flicker noise follows number fluctuation model for NMOS and mobility fluctuation model for PMOS, respectively. The reduction of flicker noise suggests the reduction of STI generated traps and the suppression of mobility fluctuation due to eliminated transverse stress using donut structure. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Donut | en_US |
dc.subject | Shallow-Trench Isolation (STI) | en_US |
dc.subject | Stress | en_US |
dc.subject | Mobility | en_US |
dc.subject | Flicker noise | en_US |
dc.title | The Impact of MOSFET Layout Dependent Stress on High Frequency Characteristics and Flicker Noise | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/RFIC.2010.5477296 | en_US |
dc.identifier.journal | 2010 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS RFIC SYMPOSIUM | en_US |
dc.citation.spage | 577 | en_US |
dc.citation.epage | 580 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000287515700132 | - |
Appears in Collections: | Conferences Paper |
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