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dc.contributor.authorWang, JCen_US
dc.contributor.authorHung, YPen_US
dc.contributor.authorLee, CLen_US
dc.contributor.authorLei, TFen_US
dc.date.accessioned2014-12-08T15:39:40Z-
dc.date.available2014-12-08T15:39:40Z-
dc.date.issued2004-02-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1640630en_US
dc.identifier.urihttp://hdl.handle.net/11536/27086-
dc.description.abstractThis work demonstrates the improved characteristics of an ultrathin CeO2 dielectric by using the post-N2O plasma treatment with additional rapid thermal N-2 annealing. The CeO2 after the treatment exhibits superior characteristics such as a small effective oxide thickness (similar to2.25 nm), a low leakage current (5.4 x 10(-4) A/cm(2)), a high breakdown electric field (-24 MV/cm), a long projected 10 yr lifetime (-12 MV/cm), a small capacitance-voltage hysteresis (25 mV), and a high barrier height for Frenkel-Poole emission (0.55 eV). These good properties are attributed to the nitrogen incorporation into the dielectric to eliminate the traps after annealing. The postnitridation annealing appears to be a very useful treatment for future ultrathin metal-oxide gate dielectrics. (C) 2004 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleImproved characteristics of ultrathin CeO2 by using postnitridation annealingen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1640630en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume151en_US
dc.citation.issue2en_US
dc.citation.spageF17en_US
dc.citation.epageF21en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000188182100048-
dc.citation.woscount18-
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