標題: | Monitor and eliminate the circular defects in HDP-STI deposition through oxynitride/oxide composite liner |
作者: | Lan, JK Wang, YL Liu, CP Lee, WH Ay, C Cheng, YL Chang, SC 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | shallow trench isolation;composite liner;circular defects |
公開日期: | 30-一月-2004 |
摘要: | This paper investigates. the monitor and elimination methods for the circular defects in high-density-plasma shallow trench isolation (HDP-STI) deposition process. The optical measurement method can monitor the circular defects in early stage. When the thickness of silane-burst film exceeds 7.8 nm, the fit-error can alert the circular defects. The oxynitride/oxide composite liner can eliminate the circular defects. Besides this, the oxynitride/oxide composite liner can also improve the breakdown strength of the STI oxide. The breakdown strength of the STI oxide increases, respectively, 375 and 30% in the wafer center and edge. The uniformity of the STI breakdown strength was reduced from greater than 200% to less than 10% using the composite liner. The traditional N2O plasma treatment for stabilizing the oxynitride film is harmful in the HDP-STI process. The N2O plasma treatment shows the worst circular defect performance. (C) 2003 Elsevier B.V. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.tsf.2003.09.039 http://hdl.handle.net/11536/27124 |
ISSN: | 0040-6090 |
DOI: | 10.1016/j.tsf.2003.09.039 |
期刊: | THIN SOLID FILMS |
Volume: | 447 |
Issue: | |
起始頁: | 645 |
結束頁: | 650 |
顯示於類別: | 會議論文 |