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dc.contributor.authorYang, MYen_US
dc.contributor.authorYu, DSen_US
dc.contributor.authorChin, Aen_US
dc.date.accessioned2014-12-08T15:39:52Z-
dc.date.available2014-12-08T15:39:52Z-
dc.date.issued2004en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/27241-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1752935en_US
dc.description.abstractThe integrity of the metal-insulator-metal (MM) capacitor with high-k La2O3 dielectrics formed using a 400degreesC back-end process was investigated. A very high capacitance per unit area of 9.2 fF/mum(2) was achieved for La2O3 MIM capacitors at 1 MHz, significantly reducing the chip size of radio frequency (rf) circuits. A mathematical derivation, involving measured S parameters, yielded the small voltage-dependent capacitance (DeltaC/C) less than or equal to 100 ppm at 1 GHz, indicating that the precision capacitor circuit can be applied in the rf regime. Furthermore, such a high capacitance density can be maintained as the frequency is increased from 10 KHz to 20 GHz with a large Q factor greater than or equal to90. (C) 2004 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleHigh-density RF MIM capacitors using high-k La2O3 dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1752935en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume151en_US
dc.citation.issue7en_US
dc.citation.spageF162en_US
dc.citation.epageF165en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000222676300058-
dc.citation.woscount11-
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