完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen, LCen_US
dc.contributor.authorHsu, CYen_US
dc.contributor.authorLan, WHen_US
dc.contributor.authorTeng, SYen_US
dc.date.accessioned2014-12-08T15:40:15Z-
dc.date.available2014-12-08T15:40:15Z-
dc.date.issued2003-10-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0038-1101(03)00129-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/27479-
dc.description.abstractNi/AuBe as p-type ohmic contact to p-GaN in the heat treatment process are reported. By selection of an optimum condition, the best construction of Ni/AuBe bi-layers is 5 nm/5 nm thick. The light-transmission is about 75% for 470 nm blue light and the lowest specific contact resistance obtained is 2 x 10(-3) Omega cm(2) examined by transmission line model after heat treatment process at 500 degreesC alloying temperature during 10 min in nitrogen ambient. The Be atom may plays an important role in the formation of good ohmic contacts. On the other hand, Ni/AuBe bi-layers are also applied to GaN-based light-emitting diodes (LEDs) as p-type ohmic contact electrode. The typical I-V characteristics of the GaN-based LEDs with 5 nm/5 nm-thick Ni/AuBe TCL exhibit a forward-bias voltage of 3.41 V at injection Current of 20 mA. (C) 2003 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectlight-emitting diodesen_US
dc.subjectNi/AuBeen_US
dc.titleGaN-based light-emitting diodes with Ni/AuBe transparent conductive layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0038-1101(03)00129-1en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume47en_US
dc.citation.issue10en_US
dc.citation.spage1843en_US
dc.citation.epage1846en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000185129400040-
dc.citation.woscount36-
顯示於類別:期刊論文


文件中的檔案:

  1. 000185129400040.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。