標題: | Wafer bonding by Ni-induced crystallization of amorphous silicon |
作者: | Chao, CP Wu, YCS Lee, TL Wang, YH 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | wafer bonding;amorphous silicon;metal-induced crystallization of amorphous silicon;nickel and electric field |
公開日期: | 1-Sep-2003 |
摘要: | Wafer bonding by Ni-induced crystallization of amorphous silicon was investigated. It was found that wafers can be bonded through the crystallization of amorphous silicon at temperatures below 550 degreesC. Moreover, when 250 V was applied across the stacked samples, the bonding temperatures could be decreased to as low as 350 degreesC. |
URI: | http://dx.doi.org/10.1143/JJAP.42.5527 http://hdl.handle.net/11536/27549 |
ISSN: | 0021-4922 |
DOI: | 10.1143/JJAP.42.5527 |
期刊: | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS |
Volume: | 42 |
Issue: | 9A |
起始頁: | 5527 |
結束頁: | 5530 |
Appears in Collections: | Articles |
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