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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorHwang, Chih-Hongen_US
dc.contributor.authorCheng, Hui-Wenen_US
dc.date.accessioned2014-12-08T15:40:40Z-
dc.date.available2014-12-08T15:40:40Z-
dc.date.issued2009-04-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.48.04C051en_US
dc.identifier.urihttp://hdl.handle.net/11536/27743-
dc.description.abstractVariability in the characteristics of nanoscale complementary metal-oxide-semiconductor (CMOS) field-effect transistors is a major challenge to scaling and integration. However, little attention has been focused on the existence of transient behavior fluctuations of devices owing to random dopant placement. In this study, we explore the discrete-dopant-induced transient behavior fluctuations of 16-nm-gate CMOS circuits through a three-dimensional large-scale statistically sound "atomistic" device-circuit-coupled simulation approach, concurrently capturing "dopant concentration variation" and "dopant position fluctuation". For a 16-nm-gate CMOS inverter, a 3.5% variation of the rise time, a 2.4% variation of the fall time, an 18.3% variation of the high-to-low delay time, and a 13.2% variation of the low-to-high delay time are estimated and discussed. Fluctuation suppression techniques proposed from the device and the circuit viewpoints are implemented to examine the associated intrinsic fluctuations. (C) 2009 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleDiscrete-Dopant-Fluctuated Transient Behavior and Variability Suppression in 16-nm-Gate Complementary Metal-Oxide-Semiconductor Field-Effect Transistorsen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.48.04C051en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume48en_US
dc.citation.issue4en_US
dc.citation.epageen_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000265652700052-
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