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dc.contributor.authorKim, SJen_US
dc.contributor.authorCho, BJen_US
dc.contributor.authorLi, MFen_US
dc.contributor.authorZhu, CXen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorKwong, DLen_US
dc.date.accessioned2014-12-08T15:40:40Z-
dc.date.available2014-12-08T15:40:40Z-
dc.date.issued2003-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2003.814024en_US
dc.identifier.urihttp://hdl.handle.net/11536/27746-
dc.description.abstractA high-density metal-insulator-metal (MIM) capacitor with a lanthanide-doped HfO2 dielectric prepared by physical vapor deposition (PVD) is presented for the first time. A significant improvement was shown in both the voltage coefficient of capacitance (VCC) and the leakage current density of MIM capacitor, yet the high capacitance density of HfO2 dielectrics was maintained by achieving the doping of Tb with an optimum concentration in HfO2. This technique allows utilizing thinner dielectric film in MIM capacitors and achieving a capacitance density as high as 13.3 fF/mum(2) with leakage current and VCC values that fully meet requirements from year 2005 for radio frequency (RF) bypass capacitors applications.en_US
dc.language.isoen_USen_US
dc.subjectcapacitance densityen_US
dc.subjectco-sputteringen_US
dc.subjectHfO2en_US
dc.subjectlanthanideen_US
dc.subjectmetal-insulator-metal (MIM) capacitoren_US
dc.subjectvoltage coefficient of capacitor (VCC)en_US
dc.titleLanthanide (Tb)-doped HfO2 for high-density MIM capacitorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2003.814024en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume24en_US
dc.citation.issue7en_US
dc.citation.spage442en_US
dc.citation.epage444en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000184454900008-
dc.citation.woscount17-
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