Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD

Title:	Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD
Authors:	Chang, Chin-Cheng Leu, Jihperng Lin, Mao-Hsing Huang, Kun-Feng 材料科學與工程學系 Department of Materials Science and Engineering
Issue Date:	2009
Abstract:	Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.
URI:	http://hdl.handle.net/11536/28498
Journal:	2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III
Begin Page:	838
End Page:	841
Appears in Collections:	Conferences Paper