Title: A NEW GRID-GENERATION METHOD FOR 2-D SIMULATION OF DEVICES WITH NONPLANAR SEMICONDUCTOR SURFACE
Authors: CHIN, SP
WU, CY
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Issue Date: 1-Sep-1993
Abstract: A general analytical method is proposed to transform a 2-D multilayer physical domain with the nonplanar semiconductor surface into a 2-D rectangular mathematical domain with the planar surface, in which a set of Fourier series are used to describe a general conformal mapping for each layer. Based on the proposed method, a simple iteration algorithm, which incorporates a nonlinear Jacobian-iteration method with the fast- Fourier transformation (FFT), is developed to solve a system of nonlinear equations due to the mutually coupled boundary conditions. As a result of the analytical conformal mapping, a regular, deformable grid-structure can be applied to simulate the device structure with the nonplanar semiconductor surface, and the device simulator using the conventional rectangle-based grid can be easily modified to simulate the device with the nonplanar semiconductor surface.
URI: http://dx.doi.org/10.1109/43.240081
http://hdl.handle.net/11536/2878
ISSN: 0278-0070
DOI: 10.1109/43.240081
Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
Volume: 12
Issue: 9
Begin Page: 1337
End Page: 1344
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