| 標題: | A NEW GRID-GENERATION METHOD FOR 2-D SIMULATION OF DEVICES WITH NONPLANAR SEMICONDUCTOR SURFACE |
| 作者: | CHIN, SP WU, CY 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
| 公開日期: | 1-Sep-1993 |
| 摘要: | A general analytical method is proposed to transform a 2-D multilayer physical domain with the nonplanar semiconductor surface into a 2-D rectangular mathematical domain with the planar surface, in which a set of Fourier series are used to describe a general conformal mapping for each layer. Based on the proposed method, a simple iteration algorithm, which incorporates a nonlinear Jacobian-iteration method with the fast- Fourier transformation (FFT), is developed to solve a system of nonlinear equations due to the mutually coupled boundary conditions. As a result of the analytical conformal mapping, a regular, deformable grid-structure can be applied to simulate the device structure with the nonplanar semiconductor surface, and the device simulator using the conventional rectangle-based grid can be easily modified to simulate the device with the nonplanar semiconductor surface. |
| URI: | http://dx.doi.org/10.1109/43.240081 http://hdl.handle.net/11536/2878 |
| ISSN: | 0278-0070 |
| DOI: | 10.1109/43.240081 |
| 期刊: | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS |
| Volume: | 12 |
| Issue: | 9 |
| 起始頁: | 1337 |
| 結束頁: | 1344 |
| Appears in Collections: | Articles |
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