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dc.contributor.authorCheng, HCen_US
dc.contributor.authorLin, CWen_US
dc.contributor.authorCheng, LJen_US
dc.contributor.authorTseng, CHen_US
dc.contributor.authorChang, TKen_US
dc.contributor.authorPeng, YCen_US
dc.contributor.authorWang, WTen_US
dc.date.accessioned2014-12-08T15:42:55Z-
dc.date.available2014-12-08T15:42:55Z-
dc.date.issued2002-01-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.1421748en_US
dc.identifier.urihttp://hdl.handle.net/11536/29084-
dc.description.abstractA novel approach for fabricating low-temperature poly-Si (LTPS) thin film transistors (TFTs) with self-aligned graded lightly doped drain (LDD) structure was demonstrated. The self-aligned graded LDD structure was formed by side-etching the Al gate under the photoresist followed by excimer laser irradiation for dopant activation and lateral diffusion. The graded LDD poly-Si TFTs exhibited low-leakage-current characteristics without significantly sacrificing driving capability due to the graded dopant distribution in the LDD regions, in which the drain electric field could be reduced. The leakage current of 1 mum graded LDD UPS TFTs at Vds = 5 V and Vgs = -10 V could reach below 1 pA/mum, and the on/off current ratio at Vds = 5 V exceeded 10(7). (C) 2001 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleFabrication of low-temperature poly-Si thin film transistors with self-aligned graded lightly doped drain structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1421748en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume5en_US
dc.citation.issue1en_US
dc.citation.spageG1en_US
dc.citation.epageG3en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000172803200015-
dc.citation.woscount3-
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