標題: Application of inverse problem algorithm for temperature uniformity in rapid thermal processing
作者: Lin, S
Chu, HS
機械工程學系
Department of Mechanical Engineering
關鍵字: temperature uniformity;rapid thermal processing;inverse problem algorithm
公開日期: 1-Jan-2002
摘要: This article presents a finite-difference-method formulation to the application of inverse problem algorithms for uniform temperature tracking of several different linear ramp-up rates in rapid thermal processing. A one-dimensional thermal model and temperature-dependent thermal properties of silicon wafers are used. The required incident-heat-flux profiles for temperature uniformity across 300-mm-diameter 0.775-mm-thick silicon wafer were intuitively evaluated. Our numerical results indicate theft temperature non-uniformity occurring during the ramp increase with the ramp-up rate. Although a linear ramp-up rate of 300 degreesC/s was used and random errors did reach 3.864 degreesC, the temperature over the wafer was maintained within 0.665 degreesC of the wafer center if the incident-heat-flux profiles were dynamically controlled according to the inverse results. These temperature non-uniformities could be acceptable in the advanced rapid thermal processing system. (C) 2002 Elsevier Science B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/S0040-6090(01)01630-3
http://hdl.handle.net/11536/29090
ISSN: 0040-6090
DOI: 10.1016/S0040-6090(01)01630-3
期刊: THIN SOLID FILMS
Volume: 402
Issue: 1-2
起始頁: 280
結束頁: 289
Appears in Collections:Articles


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