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dc.contributor.authorLee, JWen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorLee, CLen_US
dc.date.accessioned2014-12-08T15:43:19Z-
dc.date.available2014-12-08T15:43:19Z-
dc.date.issued2001-11-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.962647en_US
dc.identifier.urihttp://hdl.handle.net/11536/29327-
dc.description.abstractHigh tunneling current and large resistance against stress were the main issue of tunnel oxide for scaling down the operation voltage of EEPROMs. In this letter, thin-tunnel oxides grown on a CF4 pretreated silicon substrate were prepared and investigated for the first time. The fabricated oxide has about three orders of tunneling current higher than that of control one; furthermore, the stress induced anomalous and low electric field leakage currents were greatly suppressed. The improvement could be contributed to F-incorporation in oxide. This type of oxide is suitable for fabricating low-voltage EEPROMs and less process complexity was added.en_US
dc.language.isoen_USen_US
dc.subjectanomalous currenten_US
dc.subjectCF4 fluorinated oxideen_US
dc.subjectlow-voltage EEPROMen_US
dc.subjectplasma pretreatmenten_US
dc.subjectSILCen_US
dc.subjecttunnel oxideen_US
dc.titleThin tunnel oxide grown on silicon substrate pretreated by CF4 plasmaen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.962647en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume22en_US
dc.citation.issue11en_US
dc.citation.spage513en_US
dc.citation.epage515en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000171933100005-
dc.citation.woscount1-
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