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dc.contributor.authorTsai, MYen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorLee, DYen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:43:41Z-
dc.date.available2014-12-08T15:43:41Z-
dc.date.issued2001-07-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.930687en_US
dc.identifier.urihttp://hdl.handle.net/11536/29553-
dc.description.abstractThe impacts of soft-breakdown (SBD) on the characteristics of deep sub-micron NMOSFETs were investigated. It is shown that the ED location plays a crucial role in the post-ED switching function of the device, When ED occurs at the channel, the turn-on behavior of the drain current would not be significantly affected, which is in strong contrast to the case of ED at the drain. Nevertheless, significant increase in gate current is observed in the off-state when the gate voltage is more negative than -1 V, Its origin is identified to be due to the action of two parasitic bipolar transistors formed after SBD occurrence at the channel.en_US
dc.language.isoen_USen_US
dc.subjectgate induced drain leakageen_US
dc.subjectgate leakageen_US
dc.subjectparasitic bipolar transistoren_US
dc.subjectsoft-breadownen_US
dc.titlePost-soft-breakdown characteristics of deep submicron NMOSFETs with ultrathin gate oxideen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.930687en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume22en_US
dc.citation.issue7en_US
dc.citation.spage348en_US
dc.citation.epage350en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000169452500014-
dc.citation.woscount9-
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