完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Pan, TM | en_US |
dc.contributor.author | Lei, TF | en_US |
dc.contributor.author | Chao, TS | en_US |
dc.date.accessioned | 2014-12-08T15:44:02Z | - |
dc.date.available | 2014-12-08T15:44:02Z | - |
dc.date.issued | 2001-03-15 | en_US |
dc.identifier.issn | 0021-8979 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1063/1.1347405 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/29764 | - |
dc.description.abstract | High-k cobalt-titanium oxide (CoTiO3) and nickel-titanium oxide (NiTiO3) were formed by directly oxidizing sputtered Co/Ti and Ni/Ti film. Al/CoTiO3/Si3N4/Si and Al/NiTiO3/Si3N4/Si capacitor structures were fabricated and measured. The effective dielectric constant (k value congruent to 45) with buffer layer for CoTiO3 is larger than that of NiTiO3. In addition, CoTiO3 depicts excellent electrical properties at the same time. This metal oxide thus appears to be a very promising high-k gate dielectric for future ultralarge scale integrated devices. (C) 2001 American Institute of Physics. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Comparison of ultrathin CoTiO3 and NiTiO3 high-k gate dielectrics | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1063/1.1347405 | en_US |
dc.identifier.journal | JOURNAL OF APPLIED PHYSICS | en_US |
dc.citation.volume | 89 | en_US |
dc.citation.issue | 6 | en_US |
dc.citation.spage | 3447 | en_US |
dc.citation.epage | 3452 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000167248100059 | - |
dc.citation.woscount | 17 | - |
顯示於類別: | 期刊論文 |