完整後設資料紀錄
DC 欄位語言
dc.contributor.authorEzhilvalavan, Sen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:44:55Z-
dc.date.available2014-12-08T15:44:55Z-
dc.date.issued2000-08-15en_US
dc.identifier.issn0254-0584en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0254-0584(00)00253-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/30330-
dc.description.abstractThis paper reviews the recent developments of (Ba,Sr)TiO3 (BST) thin films for future Gbit era dynamic random access memory (DRAM) applications. The trends of DRAM capacitors in the last decade are briefly described first. Then the technological aspects of BST films such as deposition techniques, post-annealing, physical, electrical and dielectric characteristics of the films, effects of electrode materials, dielectric relaxation and defect analysis and the reliability phenomena associated with the films are briefly reviewed with specific examples from recent literature. The basic mechanisms that control the bulk electrical conduction and the origin of leakage currents in BST films are also discussed. Finally, possible developments of gigabit era DRAM technology are summarized. (C) 2000 Elsevier Science S.A. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectBSTen_US
dc.subjectthin filmsen_US
dc.subjectdielectricsen_US
dc.subjectDRAM capacitorsen_US
dc.subjectleakage current densityen_US
dc.subjectdielectric constanten_US
dc.subjectreliabilityen_US
dc.titleProgress in the developments of (Ba,Sr)TiO3 (BST) thin films for Gigabit era DRAMsen_US
dc.typeReviewen_US
dc.identifier.doi10.1016/S0254-0584(00)00253-4en_US
dc.identifier.journalMATERIALS CHEMISTRY AND PHYSICSen_US
dc.citation.volume65en_US
dc.citation.issue3en_US
dc.citation.spage227en_US
dc.citation.epage248en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000087849500001-
dc.citation.woscount208-
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