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dc.contributor.authorChen, MJen_US
dc.contributor.authorKang, TKen_US
dc.contributor.authorLiu, CHen_US
dc.contributor.authorChang, YJen_US
dc.contributor.authorFu, KYen_US
dc.date.accessioned2014-12-08T15:45:02Z-
dc.date.available2014-12-08T15:45:02Z-
dc.date.issued2000-07-24en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/11536/30382-
dc.description.abstractAn existing cell-based percolation model with parameter correlation can find its potential applications in assessing soft-breakdown (BD) statistics as long as the oxide thinning due to the localized physical damage near the SiO2/Si interface is accounted for. The resulting model is expressed explicitly with the critical trap number per cell n(BD) and the remaining oxide thickness t(ox)(') both as parameters. Reproduction of time-to-bimodal (soft- and hard-) breakdown statistical data from 3.3-nm-thick gate-oxide samples yields n(BD) of 3 and 4 for soft and hard breakdown, respectively. The extracted t(ox)(') of 1.0 nm for soft breakdown, plus the transition layer thickness of 0.5 nm in the model, is fairly comparable with literature values from current-voltage fitting. The dimension and area of the localized physically damaged region or percolation path (cell) are quantified as well. Based on the work, the origins of soft and hard breakdown are clarified in the following: (i) soft breakdown behaves intrinsically as hard breakdown, that is, they share the same defect (neutral trap) generation process and follow Poisson random statistics; (ii) both are independent events corresponding to different t(ox)(') requirements; and (iii) hard breakdown takes place in a certain path located differently from that for the first soft breakdown. (C) 2000 American Institute of Physics. [S0003-6951(00)02130-6].en_US
dc.language.isoen_USen_US
dc.titleOxide thinning percolation statistical model for soft breakdown in ultrathin gate oxidesen_US
dc.typeArticleen_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume77en_US
dc.citation.issue4en_US
dc.citation.spage555en_US
dc.citation.epage557en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000088225400032-
dc.citation.woscount19-
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