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dc.contributor.authorShih, PSen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorPeng, DZen_US
dc.contributor.authorYeh, CFen_US
dc.date.accessioned2014-12-08T15:46:20Z-
dc.date.available2014-12-08T15:46:20Z-
dc.date.issued1999-08-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.778164en_US
dc.identifier.urihttp://hdl.handle.net/11536/31174-
dc.description.abstractWe have proposed and successfully demonstrated a novel process for fabricating lightly doped drain (LDD) polycrystalline silicon thin-film transistors (TFT's), The oxide sidewall spacer in the new process is formed by a simple one-step selective liquid phase deposition (LPD) oxide performed at 23 degrees C, Devices fabricated with the new process exhibit a lower leakage current and a better ON/OFF current ratio than non-LDD control devices. Since the apparatus used for LPD oxide deposition is simple and inexpensive, the new process appears to be quite promising for future high-performance poly-Si TFT fabrication.en_US
dc.language.isoen_USen_US
dc.titleA novel lightly doped drain polysilicon thin-film transistor with oxide sidewall spacer formed by one-step selective liquid phase depositionen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.778164en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume20en_US
dc.citation.issue8en_US
dc.citation.spage421en_US
dc.citation.epage423en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000081791700014-
dc.citation.woscount12-
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