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dc.contributor.authorLin, BCen_US
dc.contributor.authorCheng, YCen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorWang, Ten_US
dc.contributor.authorTsai, Cen_US
dc.date.accessioned2014-12-08T15:46:45Z-
dc.date.available2014-12-08T15:46:45Z-
dc.date.issued1999-04-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.38.2337en_US
dc.identifier.urihttp://hdl.handle.net/11536/31434-
dc.description.abstractWe have studied and compared stress-induced leakage current in oxides subjected to H-2 and D-2 annealing. There is not much difference in stress-induced leakage current between thick 70-Angstrom-oxides annealed by these two isotopes. In sharp contrast, an improvement of several-fold in stress-induced leakage current is observed in 27-Angstrom-thick oxides annealed in D-2 ambient compared to that annealed in H-2. The significant improvement in this direct-tunneling oxide may be due to the passivation of intrinsic defects and dangling bonds in a transition SiOx layer.en_US
dc.language.isoen_USen_US
dc.subjectstress-induced leakage currenten_US
dc.subjectSILCen_US
dc.subjectultra thin oxideen_US
dc.subjectdeuteriumen_US
dc.subjectannealingen_US
dc.titleDeuterium effect on stress-induced leakage currenten_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.38.2337en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume38en_US
dc.citation.issue4Ben_US
dc.citation.spage2337en_US
dc.citation.epage2340en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000082871300034-
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