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dc.contributor.authorWu, YHen_US
dc.contributor.authorChen, WJen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorTsai, Cen_US
dc.date.accessioned2014-12-08T15:46:59Z-
dc.date.available2014-12-08T15:46:59Z-
dc.date.issued1999-01-25en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/11536/31566-
dc.description.abstractWe have investigated the effect of native oxide on the epitaxial SiGe from deposited amorphous Ge on Si. Instead of epitaxial growth by molecular beam epitaxy or ultrahigh-vacuum chemical vapor deposition, the SiGe layer is formed by this simple process followed by an annealing step. As observed by transmission electron microscopy, the suppression of native oxide plays an important role to achieve epitaxial SiGe. The SiGe quality degrades with increasing native oxide thickness and becomes polycrystalline with a similar to 20 Angstrom interfacial native oxide. On the other hand, single crystalline SiGe can be routinely formed from a HF-vapor treated Si surface. (C) 1999 American Institute of Physics. [S0003-6951(99)04504-0].en_US
dc.language.isoen_USen_US
dc.titleThe effect of native oxide on epitaxial SiGe from deposited amorphous Ge on Sien_US
dc.typeArticleen_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume74en_US
dc.citation.issue4en_US
dc.citation.spage528en_US
dc.citation.epage530en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000078174800016-
dc.citation.woscount16-
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