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dc.contributor.authorHSU, SLen_US
dc.contributor.authorLIU, LMen_US
dc.contributor.authorFANG, CHen_US
dc.contributor.authorYING, SLen_US
dc.contributor.authorCHEN, TLen_US
dc.contributor.authorLIN, MSen_US
dc.contributor.authorCHANG, CYen_US
dc.date.accessioned2014-12-08T15:04:41Z-
dc.date.available2014-12-08T15:04:41Z-
dc.date.issued1993-01-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.249423en_US
dc.identifier.urihttp://hdl.handle.net/11536/3187-
dc.description.abstractSevere field inversion has been observed in the circuits fabricated by the CMOS double metal process using PETEOS/inorganic SOG/PEOX as the inter-metal dielectrics and PEOX/PECVD nitride as the passivation layer. We have performed detailed studies to conclude that the field inversion is caused by the interaction between PETEOS and non-carbon-based SOG, triggered by the H+ released from PECVD nitride during the sintering. No field inversion is observed when PEOX/inorganic SOG/PEOX is used as the inter-metal dielectrics. The effect of field inversion on the circuit yield is also discussed.en_US
dc.language.isoen_USen_US
dc.titleFIELD INVERSION GENERATED IN THE CMOS DOUBLE-METAL PROCESS DUE TO PETEOS AND SOG INTERACTIONSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.249423en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume40en_US
dc.citation.issue1en_US
dc.citation.spage49en_US
dc.citation.epage53en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1993KC14400008-
dc.citation.woscount9-
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