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dc.contributor.authorHuang, Shih-Haoen_US
dc.contributor.authorChen, Wei-Zenen_US
dc.contributor.authorChang, Yu-Weien_US
dc.contributor.authorHuang, Yang-Tungen_US
dc.date.accessioned2014-12-08T15:47:46Z-
dc.date.available2014-12-08T15:47:46Z-
dc.date.issued2011-05-01en_US
dc.identifier.issn0018-9200en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JSSC.2011.2116430en_US
dc.identifier.urihttp://hdl.handle.net/11536/31953-
dc.description.abstractThis paper describes the design of a 10-Gb/s fully integrated CMOS optical receiver, which consists of a novel spatially-modulated photo detector (SMPD), a low-noise trans-impedance amplifier (TIA), and a post-limiting amplifier on a single chip. The bandwidth of proposed meshed SMPD can be boosted up to 6.9 GHz under a reverse-biased voltage of 14.2 V. The measured responsivity of the meshed SMPD is 29 mA/W as illuminated by 850-nm light source. To compensate the relatively low responsivity of on-chip CMOS photo detector (PD), a high-gain TIA with nested feedback and shunt peaking is proposed to achieve low-noise operation. The optical receiver is capable of delivering 25-k Omega conversion gain when driving 50-Omega output loads. For a PRBS test pattern of 2(7)-1, the 10-Gb/s optoelectronic integrated circuit (OEIC) has optical sensitivity of -6 dBm at a bit-error rate (BER) of 10(-11). Implemented in a generic 0.18-mu m CMOS technology, the chip area is 0.95 mm by 0.8 mm. The trans-impedance amplifier, post amplifier, and output buffer respectively drain 38 mW, 80 mW, and 27 mW from the 1.8-V supply.en_US
dc.language.isoen_USen_US
dc.subjectOptical receiveren_US
dc.subjectoptoelectronic integrated circuit (OEIC)en_US
dc.subjectspatially-modulated photo detector (SMPD)en_US
dc.subjecttransimpedance amplifier (TIA)en_US
dc.subjectlimiting amplifier (LA)en_US
dc.titleA 10-Gb/s OEIC with Meshed Spatially-Modulated Photo Detector in 0.18-mu m CMOS Technologyen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/JSSC.2011.2116430en_US
dc.identifier.journalIEEE JOURNAL OF SOLID-STATE CIRCUITSen_US
dc.citation.volume46en_US
dc.citation.issue5en_US
dc.citation.spage1158en_US
dc.citation.epage1169en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000289908700015-
Appears in Collections:Conferences Paper


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