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dc.contributor.authorWang, Terry Tai-Juien_US
dc.contributor.authorMa, William Cheng-Yuen_US
dc.contributor.authorHung, Shih-Weien_US
dc.contributor.authorKuo, Cheng-Tzuen_US
dc.date.accessioned2014-12-08T15:48:11Z-
dc.date.available2014-12-08T15:48:11Z-
dc.date.issued2010-10-01en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2010.05.010en_US
dc.identifier.urihttp://hdl.handle.net/11536/32125-
dc.description.abstractThe nickel-nanocrystals (Ni-NCs)-embedded silicon nitride acting as a trapping layer has been successfully demonstrated to manipulate the charging and discharging of electrons in a thin film transistor (TFT) for nonvolatile memory (NVM) applications. Regarding device performance, with and without Ni-NCs in the stack and under a programming/erasing condition of +/-18 V for 1 s, a better threshold voltage shift of 3.2 V can be reached compared to a shift of 2.0 V for a stack without Ni-NCs. The shift is an index representing the value required to differentiate "0" or "1" states during operation. In this case, the diameter range and number density of Ni-NCs are 5-13 nm and 5.3 x 10(11) cm(-2), respectively. (C) 2010 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectThin film transistor (TFT)en_US
dc.subjectNon-volatile memory (NVM)en_US
dc.subjectNickel-nanocrystals (Ni-NCs)en_US
dc.titleLow temperature Ni-nanocrystals-assisted hybrid polycrystalline silicon thin film transistor for non-volatile memory applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.tsf.2010.05.010en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume518en_US
dc.citation.issue24en_US
dc.citation.spage7429en_US
dc.citation.epage7432en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
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