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dc.contributor.authorCHEN, MJen_US
dc.contributor.authorCHAO, KCen_US
dc.contributor.authorHUANG, THen_US
dc.contributor.authorTSAUR, JMen_US
dc.date.accessioned2014-12-08T15:04:43Z-
dc.date.available2014-12-08T15:04:43Z-
dc.date.issued1992-12-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.192875en_US
dc.identifier.urihttp://hdl.handle.net/11536/3224-
dc.description.abstractThe buried-type p-channel LDD MOSFET's biased at high positive gate voltage exhibit new characteristics: 1) the ratio of the drain to gate currents is about 1 X 10(-3) to 5 X 10(-3); and 2) the gate and drain currents both are functions of only the gate voltage minus the n-well bias. Such characteristics are addressed based on the formation of the surface n+ inversion layer due to the punchthrough of the buried channel to the underlying shallow p-n junction. The measured gate current is due to the Fowler-Nordheim tunneling of electrons from this inversion layer surface and the holes generated within the high-field oxide constitute the drain current. The n+ inversion layer surface potential is found to be equal to the n-well bias plus 0.55 V. As a result, not only the oxide field but also the gate and drain currents are independent of drain voltage.en_US
dc.language.isoen_USen_US
dc.titleGATE AND DRAIN CURRENTS IN OFF-STATE BURIED-TYPE P-CHANNEL LDD MOSFETSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.192875en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume13en_US
dc.citation.issue12en_US
dc.citation.spage654en_US
dc.citation.epage657en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1992JZ43700020-
dc.citation.woscount1-
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