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dc.contributor.authorYeh, Kuo-Liangen_US
dc.contributor.authorKu, Chih-Youen_US
dc.contributor.authorGuo, Jyh-Chyurnen_US
dc.date.accessioned2014-12-08T15:48:37Z-
dc.date.available2014-12-08T15:48:37Z-
dc.date.issued2010-08-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.49.084201en_US
dc.identifier.urihttp://hdl.handle.net/11536/32349-
dc.description.abstractThe impact of local strain on low frequency noise (LFN) in p-channel metal-oxide-semiconductor field effect transistor (pMOSFET) is investigated under dynamic body biases For 60 nm pMOSFET, the uni-axial compressive strain from embedded SiGe (e-SiGe) in source/drain can contribute 75% effective mobility (mu(eff)) enhancement and the proportional improvement in current (I(DS)) as well as transconductance (G(m)) However, the strained pMOSFET suffer more than 80% higher LFN (S(ID)/I(D)(2)) compared with the control pMOSFET free from strain engineering The measured LFN can be consistently explained by mobility fluctuation model and the increase of Hooge parameter (alpha(H)) appears as a key factor responsible for the higher LFN in strained pMOSFET Forward body biases (FBB) is proposed as an effective method adapted to nanoscale devices for improving mu(eff) and suppressing LFN, without resort to strain engineering (C) 2010 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleThe Impact of Uni-axial Strain on Low Frequency Noise in Nanoscale p-Channel Metal-Oxide-Semiconductor Field Effect Transistors under Dynamic Body Biasesen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.49.084201en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume49en_US
dc.citation.issue8en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000281513400047-
dc.citation.woscount0-
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