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dc.contributor.authorFan, JCen_US
dc.contributor.authorTsai, CMen_US
dc.contributor.authorChen, KYen_US
dc.contributor.authorWang, SYen_US
dc.contributor.authorLin, Gen_US
dc.contributor.authorLee, CPen_US
dc.date.accessioned2014-12-08T15:49:16Z-
dc.date.available2014-12-08T15:49:16Z-
dc.date.issued1998-03-01en_US
dc.identifier.issn0361-5235en_US
dc.identifier.urihttp://hdl.handle.net/11536/32756-
dc.description.abstractLow-resistance ohmic conduction across an epitaxially lifted-off(ELO) thin n-GaAs film and a Si substrate was obtained by attaching the ELO film on the Si substrate coated with a Pd/Ge/Pd multilayer. Good bonding and ohmic contacts to both GaAs and Si were achieved at the same time after annealing. The interface compound formation was studied by secondary ion mass spectroscopy and x-ray diffraction analyses. This ELO technology was used to fabricate an ELO stripe geometry diode laser on Si with the back-side contact on Si substrate. Good laser performance with comparable characteristics as conventional laser diodes on GaAs substrates was obtained.en_US
dc.language.isoen_USen_US
dc.subjectepitaxial lift-off (ELO) methoden_US
dc.subjectlaser diodeen_US
dc.subjectn-type GaAsen_US
dc.titleLow-resistance vertical conduction across epitaxially lifted-off n-GaAs film and Pd/Ge/Pd coated Si substrateen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF ELECTRONIC MATERIALSen_US
dc.citation.volume27en_US
dc.citation.issue3en_US
dc.citation.spage110en_US
dc.citation.epage113en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000072528800003-
dc.citation.woscount1-
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