標題: TEMPERATURE AND HUMIDITY EFFECTS ON ADHESION OF POLYIMIDE FILM TO A SILICON SUBSTRATE
作者: HU, DC
CHEN, HC
交大名義發表
材料科學與工程學系
National Chiao Tung University
Department of Materials Science and Engineering
關鍵字: ADHESION;PEEL TEST;POLYIMIDE;HUMIDITY EFFECT;HIGH TEMPERATURE PEELING;THIN FILM PACKAGING;AMINOSILANE
公開日期: 1992
摘要: A 90-degrees peel tester with substrate heating capability was built to evaluate the adhesion strength of polyimide films to a silicon substrate. The effects of polyimide film thickness and peel rate on polyimide adhesion to a silicon substrate under high or low humidity, and at elevated temperatures, have been evaluated. In a high humidity environment, a low peel strength was measured. The influence of moisture on the peel strength increases with decreasing peel rate. Peeling at elevated temperature reduces the moisture effect even under high humidity conditions. Using a low peel rate in a high humidity environment, the measured peel strength showed a maximum as the polyimide film thickness increased. No striations in peeled polyimide films were observed for peeling in a high humidity environment.
URI: http://hdl.handle.net/11536/3559
http://dx.doi.org/10.1163/156856192X00377
ISSN: 0169-4243
DOI: 10.1163/156856192X00377
期刊: JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume: 6
Issue: 5
起始頁: 527
結束頁: 536
Appears in Collections:Articles