标题: | 电浆优化之透明氧化铝锌锡薄膜电晶体特性研究 Investigation on plasma treatment in transparent Al-Zn-Sn-O thin film transistor application |
作者: | 张智翔 Chang, Chih-Hsiang 刘柏村 Liu, Po-Tsun 光电工程学系 |
关键字: | 氧化铝锌锡;电浆处理;氨气;氧气;氧化亚氮;AlZnSnO;plasma treatment;NH3;O2;N2O |
公开日期: | 2011 |
摘要: | 近年来,非晶态铟镓锌氧薄膜电晶体(InGaZnO-TFT)因具备高透光性及高载子驱动电流特性,受到极大的瞩目。但在降低成本与环保为诉求的技术目标下,铟镓锌氧组成的金属氧化物半导体材料(IGZO)中含有稀有贵重元素-铟(In)与镓(Ga),未来将会受到发展的限制。因此,开发不含贵重及稀有元素(In/ Ga free)的氧化物半导体便成为工业界与学术界共同的研究目标。本研究中,我们开发出不含贵重及稀有元素(In/Ga free)的氧化物半导体---氧化铝锌锡(Al-Zn-Sn-O),对非晶态氧化铝锌锡薄膜电晶体来进行电特性与材料特性的分析与探讨。氧化铝锌锡薄膜的光学能隙高达3.5eV以上,仅会吸收波段小于360nm的紫外光,在可见光的波段具有高穿透性。我们先藉由改变退火的温度来改善薄膜,进一步以不同电浆处理,来探讨不同电浆处理对于薄膜修补的影响。 由实验结果显示随着退火温度增加,氧的键结增强,缺陷减少,元件临界电压变小,其他电特性也随之改善。薄膜经过退火之后我们藉由氧气电浆以及氧化亚氮电浆处理,修补薄膜中缺陷态的氧,更进一步增强氧的键结,有效的提升元件在长时间操作下的可靠度,以及长时间照光操作下的可靠度。另一方面,我们希望藉由电浆处理来降低退火的温度,以减少制程的热预算。研究中,我们发现低温退火(350oC)的元件,再透过氨气电浆处理薄膜,可以增加薄膜的导电性,提高载子迁移率,成功将载子迁移率由0.48 cm2/V s提升到1.2 cm2/V s,因此极有潜力成为下个世代的主流显示技术。 Recently, the thin film transistors (TFTs) with a-IGZO thin film as active layer perform higher mobility and better reliability than conventional hydrogenated amorphous silicon TFT (a-Si: H TFT). In addition, the uniformity of a-IGZO TFT is also superior to low temperature polycrystalline silicon TFT (LTPS TFT). Therefore, the a-IGZO TFTs have been widely considered to be the most promising candidate for the next generation display technology. a-IGZO TFTs showed good electrical performance, however, containing the rare-dispersive elements(In, Ga), will be an important issue for the long-term application. In this work, we developed rare elements-free oxide semiconductors--- amorphous Al-Zn-Sn-O thin film transistor (a-AZTO TFT). We investigated on the physical characteristics and electrical performance of a-AZTO TFT under temperature effect of annealing process and plasma post treatment. The higher annealing temperature could strengthen the oxygen bonding, therefore the quality of the a-AZTO film improves. The electrical performance enhanced under high temperature of annealing process, as well. Moreover, O2 and N2O plasma could oxidize the AZTO film and eliminate some of the oxygen deficient. As a result, the reliability of the devices under GBS improved significantly after O2 and N2O plasma post treatment. The optical energy gap of a-AZTO films untreated and with O2 or N2O plasma treatment were about 3.5 eV which indicated that all of the a-AZTO films were insensitive to visible light. On the other hand, the electron mobility of a-AZTO TFTs enhanced after NH3 plasma post treatment. The improved device parameters could be attributed to H+ ions doping. These results showed the application potentials of a-AZTO TFT device on flat panel display technology. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#GT070050517 http://hdl.handle.net/11536/40170 |
显示于类别: | Thesis |