60GHz多晶片模組系統規劃與構裝技術之開發

Abstract

篇論文描述開發一個60GHz頻段毫米波多晶片傳送接收模組，此模組應用於短距離、高頻寬家庭網路應用、IEEE802.15.3C、ECMA-387等。此篇論文中分別對毫米波多晶片模組的構裝技術進行探討，包含了共熔合金構裝技術、銀膠構裝技術及覆晶構裝技術。在此無線傳輸模組共包含了三大架構:發射器模組、接收器模組及空腔共振抑制設計-電磁能隙架構。整個完成後的60GHz毫米波射頻收發機模組的尺寸大小為39.6 mm × 30.8 mm × 9 mm。

This thesis proposes is a development of 60GHz millimeter-wave multi-chip RF front-end module, which is to be used for Wireless High Definition, IEEE802.15.3C, ECMA-387 etc. This thesis introduced millimeter-wave multi-chip module fabrication technology, which include eutectic die attach technology、 epoxy die attach technology and flip-chip attach technology. This transceiver module comprises a transmitter module, a receiver module and electromagnetic band gap structure. The overall size of the 60GHz multi-chip module is only 39.6 mm × 30.8 mm × 9 mm.