高功率LED的散熱方式與溫度量測分析

Abstract

在發光二極體(LEDs)的研究發展上，隨著科技的發展以及製程的改善，LED 的應用以不再只適用於指向性光源，而是朝向照明應用的發展，勢必在未來的發 展上將會是人類照明應用的主要零件。 當LED的應用趨勢逐漸普及，這也代表著LED的效率以逐步提升當中。以 照明的市場所使用的LED多半屬於高功率LED的應用，以目前高功率LED的 效率大約為60~70lm/W，LED的效率之所以會提高，主要原因來自於晶片、封 裝、材料製程能力的提升，而以目前高功率LED所使用的晶片的種類可分為垂 直式晶片與水平式晶片兩種，製程方式也因晶片的不同有所差異。 本論文的將以高功率LED為主要分析重點，並針對兩種不同結構的晶片-垂 直式晶片與水平式晶片做熱阻與光學效率的分析，再藉由不同的銀膠材料與印刷 電路板(PCB)材質做比較分析，相信可藉由此分析研究將會讓我們瞭解不同晶片 所搭配不同銀膠與PCB所表現出來的效果，進而得到最佳化的高功率LED。

In the light-emitting diodes (LEDs) on the research and development, with the development of technology and process improvements, LED applications are no longer only applies to intensity directivity of light source, but rather toward the development of lighting applications, they will be the main components of human lighting applications in the future development. When the trend of the increasing popularity of LED applications, which also represents the efficiency of LED has been increased gradually. With lighting in the LED market, most are used in high-power LED applications, high-power LED current efficiency of about 60 ~ 70lm / W, The efficient reason of LED improvement, mainly from the chip, packaging, materials, process capability enhancement, and the present high-power LED chips used in the types of chips can be divided into vertical dies and horizontal dies, and the manufacturing process these two ways differ due to different chips. This thesis will be high-power LED as the main focus of the analysis, and targeted at the two different structures of the chip – the analysis of vertical dies and horizontal dies on thermal resistance and optical efficiency, and then by the colloidal silver of different materials and printed circuit board (PCB) material to do a comparative analysis, it is thought that this analysis will allow us to understand the demonstrated results from the collocation of different chips with different colloidal silver and the PCB , and thus get the best of high-power LED.