覆晶多晶片模組構裝設備開發

Abstract

覆晶技術越來越廣泛使用在晶片接合的製程上面，製程的好壞更是取決於其機構的設計。本論文提出了以自我對準機構，力量控制機構，微步進機機構去取代原有的覆晶機台的氣壓鋼及導螺桿，以改善其力量控制及平面定位的部份，並利用WINPC32及RTX即時作業系統去整合覆晶機台，使得晶片不會因為過大的壓力而壞掉，提高其製程的良率。

Flip chip technology widely used in bonding process, and the bonding process which is good or not depends on its mechanism design. This paper uses the self-aligned mechanism, the force control mechanism, micro-stepping mechanism to replace the pneumatic cylinder and lead screw on the existing flip chip machine. And use WINPC32 and the RTX real-time operating system to integrate the flip chip machine. Then the chip will not be pressured too much and broken, improve the process yield rate.