BARRIER EFFECT OF E-BEAM EVAPORATED TUNGSTEN INTERLAYER IN AL/W/PTSI METALLIZATION LAYER

doi:10.1007/BF02652125

標題:	BARRIER EFFECT OF E-BEAM EVAPORATED TUNGSTEN INTERLAYER IN AL/W/PTSI METALLIZATION LAYER
作者:	CHIOU, BS LO, HS CHANG, PH 電控工程研究所 Institute of Electrical and Control Engineering
公開日期:	1-九月-1988
URI:	http://dx.doi.org/10.1007/BF02652125 http://hdl.handle.net/11536/4490
ISSN:	0361-5235
DOI:	10.1007/BF02652125
期刊:	JOURNAL OF ELECTRONIC MATERIALS
Volume:	17
Issue:	5
起始頁:	397
結束頁:	404
顯示於類別：	期刊論文