完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chuang, HF | en_US |
dc.contributor.author | Lee, CP | en_US |
dc.contributor.author | Tsai, CM | en_US |
dc.contributor.author | Liu, DC | en_US |
dc.contributor.author | Tsang, JS | en_US |
dc.contributor.author | Fan, JC | en_US |
dc.date.accessioned | 2014-12-08T15:01:08Z | - |
dc.date.available | 2014-12-08T15:01:08Z | - |
dc.date.issued | 1998-01-01 | en_US |
dc.identifier.issn | 0021-8979 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/44 | - |
dc.description.abstract | We studied the thermal reaction of Pd/In0.52Al0.48As contacts using capacitance-voltage (C-V), current-voltage, Auger electron spectroscopy, and x-ray diffraction analyses and compared the results to those for Pd/Al0.25Ga0.75As and Pd/In0.53Ga0.47As contacts. The thickness of InAlAs consumed by the reaction during annealing was calculated directly from the measured C-V profiles. Pd starts to react with InAlAs at a temperature of 100 degrees C, lower than it does with AlGaAs. For thermally annealed Pd/InAlAs and Pd/AlGaAs, both compositional and structural changes were found at the Pd/semiconductor interface. However, in heat-treated Pd/InGaAs samples, compositional changes but no structural changes were observed. (C) 1998 American Institute of Physics. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Thermal annealing of Pd/InAlAs Schottky contacts for transistor buried-gate technologies | en_US |
dc.type | Article | en_US |
dc.identifier.journal | JOURNAL OF APPLIED PHYSICS | en_US |
dc.citation.volume | 83 | en_US |
dc.citation.issue | 1 | en_US |
dc.citation.spage | 366 | en_US |
dc.citation.epage | 371 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
顯示於類別: | 期刊論文 |